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    Molybdenum Copper Alloy

    Molybdenum Copper Alloy
  • Molybdenum Copper Alloy
  • Molybdenum Copper Alloy
  • Molybdenum Copper Alloy
  • Molybdenum Copper Alloy
  • Molybdenum Copper Alloy

    MoCu alloy is a kind of pseudo-alloy that is composed of Molybdenum and Copper. It consists of both the characteristics of Molybdenum and Copper, having high thermal conductivity, low thermal expansion coefficient, non-magnetic, low gas content, ideal vacuum performance, good machinability, special high-temperature performance, etc.

    Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp. It makes MoCu suitable for volume produce.

    Typical MoCu Alloy Properties

    Material Mo Content Copper Content Density Thermal Conductivity at 25℃ CTE at 25℃
    Wt% Wt% g/cm3 W/M∙K (10-6/K)
    Mo85Cu15 85±1 Balance 10 160-180 6.8
    Mo80Cu20 80±1 Balance 9.9 170-190 7.7
    Mo70Cu30 70±1 Balance 9.8 180-200 9.1
    Mo60Cu40 60±1 Balance 9.66 210-250 10.3
    Mo50Cu50 50±0.2 Balance 9.54 230-270 11.5
    Mo40Cu60 40±0.2 Balance 9.42 280-290 11.8

    Cu/Mo/Cu (CMC)

    Description of CMC

    Cu/Mo/Cu (CMC) is a sandwich composite including a Molybdenum core layer and two copper clad layers. It has adjustable CTE and high thermal conductivity which make it suitable for heat sink, head frame and microchannel cooler for PCB. All types of CMC sheets can be stamped into components.

    Typical CMC Properties

    Material Composite Copper Content Thermal Conductivity at 25℃ W/M∙K CTE at 25℃
    Cu:Mo:Cu g/cm3 In-plane Thru-thickness (10-6/K)
    CMC13:74:13 13:74:13 9.88 200 170 5.6
    CMC 141 1:4:1 9.75 220 180 6.0
    CMC 131 1:3:1 9.66 244 190 6.8
    CMC 121 1:2:1 9.54 260 210 7.8
    CMC 111 1:1:1 9.32 305 250 8.8

    Cu/MoCu/Cu

    Description of Cu/MoCu/Cu

    Cu/MoCu/Cu is a sandwich composite similar to Cu/Mo/Cu including a MoCu alloy core layer and two Copper clad layers. The normal proportion of MoCu alloy is Mo70Cu30, sometimes Mo50Cu50 and so on. The ratio of the CTE of Cu/MoCu/Cu is adjustable. It has different CTE in x and y direction, with higher thermal conductivity than that of WCu, MoCu & CMC. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.

    Typical Cu/MoCu/Cu Properties

    Material Composite Density Thermal Conductivity at 25℃ CTE at 25℃ Tensile Strength
    Cu:Mo70Cu:Cu g/cm3 W/M∙K 10-6/K MPa
    Cu/MoCu/Cu141 1:4:1 9.5 220 7.3/10.0/8.5 380
    Cu/MoCu/Cu232 2:3:2 9.3 255 7.5/11.0/8.5 350
    Cu/MoCu/Cu111 1:1:1 9.2 260 9.5 310
    Cu/MoCu/Cu212 2:1:2 9.1 300 11.5 230

    S-CMC

    S-CMC is an sandwich composite with 5 or 7 layers, which has better thermal conductivity and anti-distortion ability than CMC. S-CMC is also suitable for stamping.

    Typical S-CMC Materials Properties

    Material Composite Density Thermal Conductivity at 25℃ W/M∙K CTE at 25℃
    Cu:Mo:Cu:Mo:Cu g/cm3 In-plane Thru-thickness (10-6/K)
    S-CMC51515 5:1:5:1:5 9.2 350 295 12.8
    S-CMC31313 3:13:1:3 9.66
    S-CMC61216 6:1:2:1:6 9.54

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