MoCu alloy is a kind of pseudo-alloy that is composed of Molybdenum and Copper. It consists of Molybdenum and Copper's characteristics, having high thermal conductivity, low thermal expansion coefficient, non-magnetic, low gas content, ideal vacuum performance, good machinability, special high-temperature performance.
Material | Mo Content | Copper Content | Density | Thermal Conductivity at 25℃ | CTE at 25℃ |
---|---|---|---|---|---|
Wt% | Wt% | g/cm3 | W/M∙K | (10-6/K) | |
Mo85Cu15 | 85±1 | Balance | 10 | 160-180 | 6.8 |
Mo80Cu20 | 80±1 | Balance | 9.9 | 170-190 | 7.7 |
Mo70Cu30 | 70±1 | Balance | 9.8 | 180-200 | 9.1 |
Mo60Cu40 | 60±1 | Balance | 9.66 | 210-250 | 10.3 |
Mo50Cu50 | 50±0.2 | Balance | 9.54 | 230-270 | 11.5 |
Mo40Cu60 | 40±0.2 | Balance | 9.42 | 280-290 | 11.8 |
Cu/Mo/Cu (CMC) is a sandwich composite including a Molybdenum core layer and two copper-clad layers. It has adjustable CTE and high thermal conductivity, making it suitable for the heat sink, head frame, and microchannel cooler for PCB. All types of CMC sheets can be stamped into components.
Material | Composite | Copper Content | Thermal Conductivity at 25℃ W/M∙K | CTE at 25℃ | |
---|---|---|---|---|---|
Cu:Mo:Cu | g/cm3 | In-plane | Thru-thickness | (10-6/K) | |
CMC13:74:13 | 13:74:13 | 9.88 | 200 | 170 | 5.6 |
CMC 141 | 1:4:1 | 9.75 | 220 | 180 | 6.0 |
CMC 131 | 1:3:1 | 9.66 | 244 | 190 | 6.8 |
CMC 121 | 1:2:1 | 9.54 | 260 | 210 | 7.8 |
CMC 111 | 1:1:1 | 9.32 | 305 | 250 | 8.8 |
Cu/MoCu/Cu is a sandwich composite similar to Cu/Mo/Cu, including a MoCu alloy core layer and two Copper clad layers. The normal proportion of MoCu alloy is Mo70Cu30, sometimes Mo50Cu50, and so on. The ratio of the CTE of Cu/MoCu/Cu is adjustable. It has different CTE in x, and y-direction, with higher thermal conductivity than WCu, MoCu & CMC. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
Material | Composite | Density | Thermal Conductivity at 25℃ | CTE at 25℃ | Tensile Strength |
---|---|---|---|---|---|
Cu:Mo70Cu:Cu | g/cm3 | W/M∙K | 10-6/K | MPa | |
Cu/MoCu/Cu141 | 1:4:1 | 9.5 | 220 | 7.3/10.0/8.5 | 380 |
Cu/MoCu/Cu232 | 2:3:2 | 9.3 | 255 | 7.5/11.0/8.5 | 350 |
Cu/MoCu/Cu111 | 1:1:1 | 9.2 | 260 | 9.5 | 310 |
Cu/MoCu/Cu212 | 2:1:2 | 9.1 | 300 | 11.5 | 230 |
S-CMC is a sandwich composite with 5 or 7 layers with better thermal conductivity and anti-distortion ability than CMC. S-CMC is also suitable for stamping.
Material | Composite | Density | Thermal Conductivity at 25℃ W/M∙K | CTE at 25℃ | |
---|---|---|---|---|---|
Cu:Mo:Cu:Mo:Cu | g/cm3 | In-plane | Thru-thickness | (10-6/K) | |
S-CMC51515 | 5:1:5:1:5 | 9.2 | 350 | 295 | 12.8 |
S-CMC31313 | 3:1:3:1:3 | 9.66 | ≈ | ≈ | ≈ |
S-CMC61216 | 6:1:2:1:6 | 9.54 | ≈ | ≈ | ≈ |