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    Tantalum Sputtering Target

    Description:

    Purity: Ta>99.95%, 99.99%, 99.995%, 99.999%
    Standard: ASTM B708-05
    Density: >16.1g/cc
    AEM can provide tantalum target with uniform, high density microstructure and controlled texture, which promotes uniform sputtering rates and generally superior sputtering behavior.
  • Chemical Composition:

    Typical Purity (ppm)
    Impurities 5N Ta 4N5 Ta 4N Ta 3N5 Ta
    Fe <1 <1 <1 <5
    Ni <1 <1 <1 <5
    Cr <1 <1 <1 <5
    Cu <1 <1 <1 <5
    Ti <1 <1 <1 <5
    Nb <10 <50 <100 <500
    W <8 <10 <30 <150
    Mo <5 <10 <10 <30
    Na <0.4 <0.4 <1 <5
    Li <0.1 <0.1 <1 <5
    K <0.4 <0.4 <1 <5
    U <0.001 <0.005 <0.005 <0.005
    Th <0.001 <0.005 <0.005 <0.005
    Others <0.1 <1 <5 <10
    C <10 <10 <20 <30
    O <50 <50 <100 <200
    N <30 <30 <30 <50
    H <5 <5 <10 <10

    Specification:

    We can supply 8″, 12″ tantalum round shape sputtering target. The largest disc target that we can provide is with 29” diameter. Below are most of the standard sizes for our tantalum rectangle sputtering targets. If you do not see the size that you need, please feel free to contact us.
    Thickness Width Length Parallelism Verticality Surface finish
    8.0~16.0 10~450 10~500 <0.05 <2o <Ra0.8
    3.0~8.0 10~450 10~800 <0.05 <2o <Ra0.8
    1.0~3.0 10~450 10~1200 <0.05 <2o <Ra0.8
    Recrystallization: >95%
    Surface Roughness: Ra 0.8-1.6
    Flatness: 0.1mm or 0.1%

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