Electronic Packaging Materials & Heat Sink Materials - AEM Metal

Power electronics and circuits produce a lot of heat when they work. Heat sink materials help to eliminate chip heat, transferring it to other media and keeping the chip stable.
 
Molybdenum copper, tungsten copper, CMC and CPC materials, combined with low thermal expansion rate of molybdenum, tungsten and conductivity of copper heat, can effectively release the heat of electronic device and contributes to the cooling of IGBT module, RF power amplifier, LED chips and other products. They are thus applied as a metal substrate, thermal control and heat insulation components (heat sink materials) and the lead frame in large-scale integrated circuit and high power microwave devices.
 
We can offer WCu, MoCu, CMC, CMCC and S-CMC finished and semi-finished products. And we can also provide these products coated with Ni, NiAu or NiAg.
 
If you are interested in purchasing WCu, please click the link and get more information. https://www.aemmetal.com/tungsten-copper-alloy.html
 
If you are interested in purchasing MoCu, CMC, CMCC and S-CMC , please click the link and get more information. https://www.aemmetal.com/molybdenum-copper-alloy.html
 
Also, we can provide electronic packaging paterials and other heat sink materials as below.
 
AlSiC

Typical AlSiC Properties
Materials	Density	CTE	Thermal Conductivity	Bending Strength
	g/cm3	10-6/K	W/M·K	MPa
Al-55%SiC	2.95	9.0	200	>420
Al-60%SiC	2.97	8.3	209	>380
Al-65%SiC	2.99	8.1	210	>320

 
Advantage
The composite material of Aluminum silicon carbide is the aluminum silicon carbide ceramic and matal compound and then into new materials, with all the excellent quality of ceramic and metal. It has thermal conductivity, low thermal expansion coefficient and good stiffness, light quality, so it is the ideal powder electronic substrate material and substrate material. With the electronic chip, it can realize good match after welding.
 
Application
IGBT products by aluminum silicon carbide substrate encapsulation are widely used in high-speed rail, subway, and new engergy cars, wind power, welding robot, etc.
 
SiAl

Typical SiAl Properties
Materials	Density	CTE	Thermal Conductivity	Bending Strength
	g/cm3	10-6/K	W/M·K	MPa
36%SiAl	2.54	13.6	150	>460
50%SiAl	2.50	11.0	128	>190

 
Advantage
SiAl can provide a better heat dissipation, can preatly prolong the service life of encapsulated power module, increase the reliability. Density of the material has light weight (2.4-2.7 g/cm³), high thermal conductivity, low thermal expansion coefficient, high stiffness, easy for machining, surface plating performance and good welding performance, good material density, high temperature resistance, corrosion resistance, etc.
 
Application
In microwave power device, it is mainly used for electronic packaging, intergrated power module, the power electronic device such as T/R module. Using silicon aluminum alloy as base of electronic packaging materials, shell, the box body, cover plate are a good match.
 
Glidcop

Typical Glidcop Properties
Grade	Electric Conductivity IACS%	Tensile Strength Δb, MPa		Percentage Elongation δ %	Hardness HRB
		Rm.	650 ℃		Rm.	900℃*1h annealing
GM-1	90-95	350-450	270-360	10-15	55-70	55-65
GM-2	85-92	450-550	380-480	7-12	65-80	58-72
GM-3	80-88	460-580	420-530	5-10	78-85	65-75

 
Advantage
Aluminum dispersion copper has thermal conductivity and thermal expansion coefficient close to copper, but its high temperature strength performance is good.
 
OFC Heat Sink

Typical OFC Materials Properties
Melting Point	Softening Temperature	Density	CTE	Thermal conductivity
℃	℃	g/cm3	10-6/K	W/M·K
1083	150	8.93	17.7	391

 
If you are interested in purchasing those materials, please submit your inquiry at https://www.aemmetal.com/resources/. You can also send emails to [email protected] and [email protected].